The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Feb. 06, 2024
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Chu-Feng Liao, Hsinchu, TW;
Hung-Ping Cheng, Chiayi City, TW;
Yuan-Yao Chang, Kaohsiung City, TW;
Shuo-Wen Chang, Hsinchu City, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
The present disclosure provides a semiconductor wafer. The semiconductor wafer includes: a scribe line between a first row of dies and a second row of dies, and a benchmark circuit disposed on the scribe line. The benchmark circuit includes a first switching circuit, a first process control monitoring (PCM) device and a second PCM device coupled to the first switching circuit, and a second switching circuit. The first switching circuit is configured to selectively couple the first PCM device and the second PCM device to receive a test signal, wherein the first PCM device and the second PCM device are configured to output a first output signal and a second output signal in response to the test signal, respectively. The second switching circuit is configured to selectively couple the first PCM device and the second PCM device to output the first output signal or the second output signal.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile