The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Dec. 16, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Akihiro Kuribayashi, Yamanashi, JP;

Kentaro Oshimo, Yamanashi, JP;

Hyunyoung Go, Yamanashi, JP;

Yudo Sugawara, Iwate, JP;

Akashi Fujio, Iwate, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
C23C 16/4586 (2013.01); C23C 16/4584 (2013.01); H10P 72/7612 (2026.01);
Abstract

A substrate-processing-apparatus includes a processing-vessel to accommodate a substrate and to process the substrate; a substrate-support that is provided inside the processing-vessel and has a mounting-surface on which the substrate is mounted; and a lift-pin-mechanism that includes a lift-pin that is movable relative to the substrate-support and a pin-housing-chamber in which the lift-pin is housed, the lift-pin-mechanism being to lift the substrate by raising the lift-pin, wherein the substrate-support has a hole through which the lift-pin is passable, the lift-pin mechanism includes a pressure-regulator that regulates the pressure in the hole by passing inert-gas through the pin-housing-chamber, and at a timing when the substrate is to be lifted, the pressure-regulator adjusts the pressure in the hole to a lifting pressure that is greater than or equal to the pressure in a processing space that is above the mounting-surface and at which the substrate remains continuously mounted on the mounting-surface.


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Kuribayashi, Akihiro. (2026). Substrate processing apparatus and substrate removal method (U.S. Patent No. 12716132). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12716132

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