The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2026
Filed:
Jul. 21, 2023
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Yuan-Hsuan Chen, Tainan City, TW;
Kei-Wei Chen, Tainan City, TW;
Ying-Lang Wang, Tien-Chung Village, TW;
Kuo-Hsiu Wei, Tainan City, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., HSINCHU, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...
H10P 52/402 ; B24B 37/005 ; H10P 52/00 ; H10P 74/203 ; H10P 74/23 ; B24B 37/04 ; B24B 49/00 ; B24B 49/04 ; B24B 49/05 ;
Chen, Yuan-Hsuan. (2026). Wafer thinning method having feedback control (U.S. Patent No. 12713859). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12713859
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile