The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2026

Filed:

Jul. 05, 2022
Applicants:

Tohoku University, Sendai-shi, JP;

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Hiroyuki Yamazaki, Joetsu-shi, JP;

Masao Ando, Joetsu-shi, Niigata-ken, JP;

Masaki Takeuchi, Joetsu-shi, JP;

Masaru Nakagawa, Sendai-shi, JP;

Shunya Ito, Sendai-shi, Miyagi, JP;

Assignees:

SHIN-ETSU CHEMICAL CO., LTD., TOKYO, JP;

TOHOKU UNIVERSITY, SENDAI-SHI, MIYAGI, JP;

Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...
B29C 59/022 ; G03F 7/0002 ; B29C 33/3842 ; B29C 33/56 ; B29K 2995/0097 ; G03F 7/0015 ;

Find Patent Forward Citations

Yamazaki, Hiroyuki. (2026). Imprint mold, method for manufacturing the same and method for manufacturing reproduced imprint mold (U.S. Patent No. 12709053). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12709053

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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