The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Dec. 16, 2022
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Kai-Jiun Chang, Taoyuan City, TW;

Yu-Huan Yeh, Hsinchu City, TW;

Chuan-Fu Wang, Miaoli County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 70/00 (2023.01); H10B 63/00 (2023.01); H10N 70/20 (2023.01);
U.S. Cl.
CPC ...
H10N 70/841 (2023.02); H10B 63/80 (2023.02); H10N 70/023 (2023.02); H10N 70/24 (2023.02); H10N 70/826 (2023.02); H10N 70/8833 (2023.02);
Abstract

A ReRAM device includes an interlayer dielectric (ILD), a lower conductive plug, a resistance-switching element (RSE) and an upper conductive plug. The ILD has an upper surface. The lower conductive plug is disposed in the ILD, and has a top surface lower than the upper surface. The RSE is disposed above the top surface and electrically contacts with the top surface. The upper conductive plug is disposed above the RSE and electrically contacts with the RSE.


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