The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Sep. 22, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jeremy D Ecton, Gilbert, AZ (US);

Leonel R. Arana, Phoenix, AZ (US);

Brandon C Marin, Chandler, AZ (US);

Srinivas Venkata Ramanuja Pietambaram, Chandler, AZ (US);

Gang Duan, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/05 (2026.01); H10W 70/685 (2026.01); H10W 70/692 (2026.01); H10W 72/00 (2026.01); H10W 74/01 (2026.01); H10W 74/47 (2026.01); H10W 80/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/05 (2026.01); H10W 70/095 (2026.01); H10W 70/685 (2026.01); H10W 70/692 (2026.01); H10W 72/0198 (2026.01); H10W 74/014 (2026.01); H10W 74/016 (2026.01); H10W 74/47 (2026.01); H10W 80/00 (2026.01); H10W 90/794 (2026.01);
Abstract

An electronic device comprises a mold layer that includes multiple integrated circuit (IC) dice having contact pads, a glass core patch embedded in encapsulating material that surrounds the top, bottom, and sides of the glass core patch, and a first redistribution layer arranged between the first mold layer and the glass core patch. The first redistribution layer includes electrically conductive interconnect that electrically connects one or more contact pads of the IC dice to the glass core patch.


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