The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Jun. 02, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd, Hsinchu, TW;

Inventors:

Wei Che Tsai, Pingtung City, TW;

Yuan Tsung Tsai, Tainan City, TW;

Hsin-Yi Tsai, Tainan, TW;

Ying Ming Wang, Tainan City, TW;

Hsien Hua Tseng, Tainan City, TW;

Shih-Hao Chen, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 10/00 (2026.01); H10D 84/83 (2025.01); H10P 50/00 (2026.01); H10W 10/17 (2026.01);
U.S. Cl.
CPC ...
H10W 10/014 (2026.01); H10D 84/83 (2025.01); H10P 50/695 (2026.01); H10W 10/17 (2026.01);
Abstract

Methods for forming a dielectric isolation region between two active regions are disclosed herein. A mandrel is formed on a substrate, then etched to form a trench. Spacers are formed on the sidewalls of the mandrel. The mandrel is removed, and the substrate is etched to form fins extending in a first direction in the two active regions, and of fins extending in a second direction. A mask is formed that exposes the substrate between the fins extending in the second direction. The substrate is etched to form a trench. The trench is filled with a dielectric material up to the top of the fins to form the dielectric isolation region. The methods provide better depth control during etching between the two active regions, and also permit the trench to extend deeper into the substrate due to reduced depth/width ratios during the etching steps.


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