Inspection apparatus for semiconductor device

Abstract

Provided is an inspecting apparatus for semiconductor device including a chamber, a substrate stage within the chamber and configured to load a test wafer, the test wafer including a plurality of wiring layers, a milling device configured to partially remove the test wafer, and a measuring device including a body portion, a light source configured to irradiate an incident light, an objective lens, a lens assembly having a plurality of optical filter and an optical splitter, wherein the lens assembly is configured to introduce the incident light such that the incident light is emitted on the test wafer; and a polarization camera configured to scan the test wafer by receiving reflected light reflected from the test wafer, wherein the measuring device is configured to measure polarization characteristic of the reflected light and uniformity of the test wafer.