The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Dec. 20, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Kristof Darmawikarta, Chandler, AZ (US);
Haobo Chen, Chandler, AZ (US);
Xiaoying Guo, Chandler, AZ (US);
Hongxia Feng, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/692 (2026.01); H10W 20/48 (2026.01); H10W 70/685 (2026.01);
U.S. Cl.
CPC ...
H10W 70/692 (2026.01); H10W 20/48 (2026.01); H10W 70/685 (2026.01);
Abstract
Methods, apparatus, systems, and articles of manufacture are disclosed to enable electrical traces on glass cores in integrated circuit packages that includes an integrated circuit (IC) package substrate comprising a glass core, a photo-imageable dielectric (PID) material on the glass core, and metal interconnects in openings in the PID material.