The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Aug. 21, 2023
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

David K. Hwang, Boise, ID (US);

Richard J. Hill, Boise, ID (US);

Gurtej S. Sandhu, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/67 (2025.01); H10D 86/01 (2025.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); G11C 11/22 (2006.01); G11C 11/408 (2006.01); G11C 11/4091 (2006.01); H10D 62/80 (2025.01);
U.S. Cl.
CPC ...
H10D 30/6713 (2025.01); H10D 30/6728 (2025.01); H10D 30/673 (2025.01); H10D 86/0212 (2025.01); H10D 86/0221 (2025.01); H10D 86/40 (2025.01); H10D 86/481 (2025.01); H10D 86/60 (2025.01); G11C 11/221 (2013.01); G11C 11/2257 (2013.01); G11C 11/2273 (2013.01); G11C 11/4085 (2013.01); G11C 11/4091 (2013.01); H10D 30/6757 (2025.01); H10D 62/80 (2025.01); H10D 62/882 (2025.01); H10D 86/423 (2025.01);
Abstract

Some embodiments include an integrated assembly having an upwardly-extending structure with a sidewall surface. Two-dimensional-material extends along the sidewall surface. First electrostatic-doping-material is adjacent a lower region of the two-dimensional-material, insulative material is adjacent a central region of the two-dimensional-material, and second electrostatic-doping-material is adjacent an upper region of the two-dimensional-material. A conductive-gate-structure is over the first electrostatic-doping-material and adjacent to the insulative material. Some embodiments include methods of forming integrated assemblies.


Find Patent Forward Citations

Hwang, David. (2026). Integrated assemblies and methods of forming integrated assemblies (U.S. Patent No. 12696483). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12696483

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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