The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Feb. 16, 2024
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masashi Shimoda, Miyagi, JP;

Yasuharu Sasaki, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02N 13/00 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
H02N 13/00 (2013.01); C23C 16/4586 (2013.01);
Abstract

An electrostatic chuck, includes: a central region configured to support a substrate; at least one through-hole formed in the central region; a first substrate contact portion arranged around the through-hole; and a second substrate contact portion arranged around the first substrate contact portion. The first substrate contact portion and the second substrate contact portion have protrusions protruding upward from the central region. The protrusions are arranged in the first substrate contact portion at a first density. The protrusions are arranged in the second substrate contact portion at a second density lower than the first density.


Find Patent Forward Citations

Shimoda, Masashi. (2026). Electrostatic chuck, substrate support, and substrate processing apparatus (U.S. Patent No. 12695399). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12695399

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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