The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Jun. 01, 2023
International Business Machines Corporation, Armonk, NY (US);
Ruilong Xie, Niskayuna, NY (US);
Chanro Park, Clifton Park, NY (US);
Juntao Li, Cohoes, NY (US);
Min Gyu Sung, Latham, NY (US);
Julien Frougier, Albany, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor device is provided including frontside interconnects (i.e., metal wires) used mainly as power supplies and backside interconnects (i.e., metal wires) used mainly as signal wiring. The semiconductor device includes a frontside back-end-of-the-line (BEOL) structure including frontside metal wires located in the frontside of the device, and a backside BEOL interconnect structure including backside metal wires located in a backside of the device. At least 90% of the frontside metal wires are power distribution metal wires and at least 90% of the backside metal wires are signal wires.