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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12690316 B1

PDFFull Text
Date of Patent:
Jul. 21, 2026

Filed:

Jul. 12, 2023

Method of making a semiconductor package with graphene for die attach

Applicant:

Stats Chippac Pte. Ltd., Singapore, SG;

Inventors:

Yongmoo Shin, Incheon, KR;

Heesoo Lee, Incheon, KR;

Sujeong Kwon, Incheon, KR;

Assignee:

STATS ChipPAC Pte. Ltd., Singapore, SG;

Attorneys:

Brian M. Kaufman

Robert D. Atkins

PATENT LAW GROUP: Atkins and Associates, P.C.

Primary Examiner:

Khiem D Nguyen

Int. Cl.
CPC ...
H10H 20/858 (2025.01); H10H 20/857 (2025.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 90/00 (2026.01); H10W 72/90 (2026.01);
U.S. Cl.
CPC ...
H10H 20/8581 (2025.01); H10H 20/857 (2025.01); H10H 20/8583 (2025.01); H10W 72/322 (2026.01); H10W 90/00 (2026.01); H10W 72/01323 (2026.01); H10W 72/0198 (2026.01); H10W 72/073 (2026.01); H10W 72/07331 (2026.01); H10W 72/07335 (2026.01); H10W 72/07354 (2026.01); H10W 72/075 (2026.01); H10W 72/07531 (2026.01); H10W 72/07554 (2026.01); H10W 72/325 (2026.01); H10W 72/347 (2026.01); H10W 72/352 (2026.01); H10W 72/353 (2026.01); H10W 72/354 (2026.01); H10W 72/865 (2026.01); H10W 72/884 (2026.01); H10W 72/90 (2026.01); H10W 72/952 (2026.01); H10W 90/732 (2026.01); H10W 90/736 (2026.01); H10W 90/753 (2026.01); H10W 90/756 (2026.01);
Abstract

A semiconductor device has a substrate with a die pad. A conductive material is disposed on the die pad. The conductive material includes a plurality of graphene-coated metal balls in a matrix. A semiconductor die is disposed on the conductive material. The conductive material is sintered using an infrared laser. A bond wire is formed between the semiconductor die and substrate. An encapsulant is deposited over the semiconductor die and bond wire.

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Quick Actions:

Shin, Yongmoo. (2026). Method of making a semiconductor package with graphene for die attach (U.S. Patent No. 12690316). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12690316

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