The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Jan. 16, 2024
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Atsuki Fukazawa, Tokyo, JP;

Hiroki Maehara, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/04 (2006.01); C23C 16/06 (2006.01); C23C 16/26 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01); C23C 16/56 (2006.01);
U.S. Cl.
CPC ...
C23C 16/045 (2013.01); C23C 16/042 (2013.01); C23C 16/06 (2013.01); C23C 16/26 (2013.01); C23C 16/45555 (2013.01); C23C 16/50 (2013.01); C23C 16/56 (2013.01);
Abstract

A substrate processing method includes step a), step b), step c), step d), step e), and step f). Step a) is a step of providing a substrate that has a pattern where a protection target film is positioned on a bottom part of the pattern. Step b) is a step of laminating a catalyst film on the protection target film. Step c) is a step of forming a protection film that supports the catalyst film from below and covers the protection target film, in the pattern, by a VLS growth method. Step d) is a step of removing the catalyst film. Step e) is a step of applying a predetermined process to a part of the substrate that is different from the pattern in a state where the protection target film is covered by the protection film. Step f) is a step of removing the protection film in the pattern.


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