The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Aug. 14, 2023
Sandisk Technologies, Inc., Milpitas, CA (US);
Darryl Wong Jun Chen, Kuching, MY;
Jiun Dong Loeh, Bayan Lepas, MY;
Muhammad Farhan Taufiq Mohamad Helmi, P. Klang, MY;
Sandisk Technologies, Inc., Milpitas, CA (US);
Abstract
A semiconductor device wherein a selected subset of bond wires is coated with an electrically insulating polymer to reduce occurrences of electrical shorts caused by wire sweep in the flow of a molding compound during an encapsulation stage of the manufacturing process. In some examples, the bond wires to be coated are selected based on a set of criteria that flag the bond wires exhibiting a relatively high tendency towards forming such electrical shorts. A specialized wire-bonding tool that can be operated to produce both polymer-coated bond wires and bare bond wires is also provided.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile