The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Feb. 01, 2024
Disco Corporation, Tokyo, JP;
Asahi Nomoto, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A wafer manufacturing method includes a separation layer forming step of forming a separation layer including a plurality of modified regions within a workpiece by moving the workpiece and a condensing point of a pulsed laser beam having a wavelength transmittable through the workpiece relative to each other at a predetermined speed along a processing feed direction in a state in which the workpiece is irradiated with the laser beam, and the condensing point of the laser beam is located at a predetermined depth position of the workpiece, and a separating step of separating a wafer from the workpiece with the separation layer as a starting point, in the separation layer forming step, a repetition frequency of the laser beam is set according to pulse energy and the relative predetermined speed between the workpiece and the condensing point such that the separation layer can be formed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile