The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Feb. 02, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chih-Chao Chou, Hsinchu City, TW;
Yi-Hsun Chiu, Zhubei City, TW;
Shang-Wen Chang, Jhubei City, TW;
Ching-Wei Tsai, Hsinchu City, TW;
Chih-Hao Wang, Baoshan Township, Hsinchu County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A package structure and a formation method are provided. The method includes disposing a first chip structure over a carrier substrate. The first chip structure has a front-side interconnection structure facing the carrier substrate. The method also includes forming a back-side interconnection structure over the first chip structure. The first chip structure has a device portion between the back-side interconnection structure and the front-side interconnection structure. The back-side interconnection structure has stacked conductive vias. The method further includes bonding a second chip structure to the first chip structure using dielectric-to-dielectric bonding and metal-to-metal bonding.