The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2026

Filed:

Sep. 09, 2022
Applicant:

Asm Ip Holding B.v., Almere, NL;

Inventors:

Donghyun Ko, Hwaseong-si, KR;

Hakjoon Lee, Seoul, KR;

Sungkyu Kang, Hwaseong-si, KR;

Assignee:

ASM IP Holding B.V., Almere, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 14/60 (2026.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); C23C 16/505 (2006.01); H01J 37/32 (2006.01); H10P 14/692 (2026.01); H10P 14/694 (2026.01);
U.S. Cl.
CPC ...
H10P 14/6336 (2026.01); C23C 16/345 (2013.01); C23C 16/402 (2013.01); C23C 16/45536 (2013.01); C23C 16/505 (2013.01); H01J 37/32082 (2013.01); H01J 37/32449 (2013.01); H10P 14/69215 (2026.01); H10P 14/69433 (2026.01); H01J 2237/332 (2013.01);
Abstract

In one embodiment, a particle with a first particle thickness may be formed on a film with a first thickness, followed by a plasma treatment. The first particle thickness may be reduced to a second particle thickness below an allowable limit and the first film thickness may be reduced to a second film thickness by the plasma treatment. In another embodiment, a particle with a first particle thickness may be formed on a first film with a first film thickness, followed by a plasma treatment. The first particle thickness may be reduced to a second particle thickness below an allowable limit and the first film thickness may be reduced to a second film thickness by the plasma treatment. After the plasma treatment, a second film with a third film thickness may be deposited on the first film and the particle may be buried in the second film.


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