The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2026

Filed:

Mar. 22, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Sanjay C. Mehta, San Jose, CA (US);

Shogo Mochizuki, Mechanicville, NY (US);

Ruilong Xie, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 62/10 (2025.01); H10D 30/67 (2025.01); H10D 84/01 (2026.01); H10D 84/03 (2025.01); H10W 10/00 (2026.01); H10W 10/10 (2026.01);
U.S. Cl.
CPC ...
H10D 62/115 (2025.01); H10D 30/6713 (2025.01); H10D 30/6735 (2025.01); H10D 30/6757 (2025.01); H10D 62/118 (2025.01); H10D 62/121 (2025.01); H10D 84/0128 (2025.01); H10D 84/013 (2025.01); H10D 84/038 (2025.01); H10W 10/011 (2026.01); H10W 10/10 (2026.01);
Abstract

A first and a second nanosheet stack, a shallow trench isolation region vertically aligned between them, a continuous dielectric layer below the first and second nanosheet stack and above the shallow trench isolation region. The shallow trench isolation region is vertically aligned with a source drain between the first and the second nanosheet stack. A method including forming a first and a second nanosheet stack on a first substrate, the first and the second nanosheet stack each including a lower nanosheet stack vertically aligned above an upper nanosheet stack, the upper nanosheet stack and the lower nanosheet stack each including alternating layers of a sacrificial material and a semiconductor channel material vertically aligned and stacked one on top of another, flipping the first substrate over, bonding an upper surface of the first substrate to an upper surface of a second substrate which includes a shallow trench isolation region.


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