The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Dec. 15, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Shravana Kumar Katakam, Lehi, UT (US);

Tao Li, Slingerlands, NY (US);

Kisik Choi, Watervliet, NY (US);

Ruilong Xie, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/41 (2026.01); H10W 20/00 (2026.01);
U.S. Cl.
CPC ...
H10W 20/427 (2026.01); H10W 20/0698 (2026.01);
Abstract

Semiconductor devices and methods of forming the same include a first semiconductor device in a first device region and a second semiconductor device in a second device region. A dielectric structure between the first device region and the second device region laterally extends part way underneath the first semiconductor device and the second semiconductor device. A buried power rail is under the dielectric structure. A conductive via penetrates the dielectric structure to connect the first semiconductor device to the buried power rail.


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