The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Nov. 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chun-Yen Lin, Hsinchu, TW;
Shih-Wei Peng, Hsinchu, TW;
Wei-Cheng Lin, Hsinchu, TW;
Jiann-Tyng Tzeng, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
An IC device in some embodiments includes a first conductive line in a first conductive layer disposed in a first plane, a second conductive line in a second conductive player disposed in a second plane, and a conductor connecting first and second conductive lines, the conductor including a conductive wall disposed in a plane substantially transverse to the first plane and have a length in a direction substantially parallel to the first plane and a height in a direction substantially transverse to the first plane. The conductive wall in some embodiments includes a conductive plate electrically interconnecting two metal diffusion regions each of which electrically connected to a respective one of the first and second conductive lines. The conductive wall in other embodiments includes two metal diffusion regions abutting each other, each of the metal diffusion regions electrically connected to a respective one of the first and second conductive lines.