The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Dec. 22, 2022
Applicant:
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Inventors:
Belgacem Haba, Saratoga, CA (US);
Rajesh Katkar, Milpitas, CA (US);
Guilian Gao, San Jose, CA (US);
Cyprian Emeka Uzoh, San Jose, CA (US);
Assignee:
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H10W 72/90 (2026.01); H10W 99/00 (2026.01); H10W 80/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 99/00 (2026.01); H10W 72/90 (2026.01); H10W 80/211 (2026.01); H10W 80/312 (2026.01); H10W 80/327 (2026.01); H10W 90/794 (2026.01);
Abstract
A bonded structure with a package substrate comprising an inorganic, insulating first bonding layer and first conductive features at a surface thereof and an electronic component comprising an inorganic, insulating second bonding layer and second conductive features at a surface thereof wherein the first bonding layer and the second bonding layer are directly bonded to one another, and the first and second conductive features are directly bonded to one another.