The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Aug. 23, 2021
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Debanjan Das, Bengaluru, IN;

Eric Samulon, Oakland, CA (US);

Darrell Ehrlich, San Jose, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/76 (2026.01); H01J 37/32 (2006.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7616 (2026.01); H01J 37/32715 (2013.01); H01J 37/32807 (2013.01); H01J 2237/3341 (2013.01); H10P 72/0421 (2026.01);
Abstract

A component of a semiconductor processing chamber formed of a metal matrix component having an anodized layer on a surface thereof. The anodized layer comprises an aluminum oxide layer and is formed over an AlSic component. The anodized layer provides the component with protection against corrosion due to plasma processing gases, as the anodized layer provides a protective coating. A layer of aluminum is plated over a surface of the component and the aluminum layer is subsequently anodized to form the protective layer.


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