The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Jul. 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chien-Ying Chen, Hsinchu, TW;
Yen-Jen Chen, Hsinchu, TW;
Yao-Jen Yang, Hsinchu, TW;
Meng-Sheng Chang, Hsinchu, TW;
Chia-En Huang, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
An integrated circuit includes a front-side horizontal conducting line and a front-side vertical conducting line at the front side of the substrate, a transistor in a semiconductor structure at the front side of the substrate, and a backside conducting line at a backside of the substrate. The front-side horizontal conducting line is directly connected to a first terminal of the transistor through a front-side terminal via-connector and directly connected to the front-side horizontal conducting line through a front-side metal-to-metal via-connector. A word connection line directly is connected to a gate terminal of the transistor through a gate via-connector. The backside conducting line is directly connected to a second terminal of the transistor through a backside terminal via-connector. In the integrated circuit, a front-side fuse element is conductively connected to either the front-side vertical conducting line or the front-side horizontal conducting line.