The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Jun. 29, 2023
Intel Corporation, Santa Clara, CA (US);
Hubert C. George, Portland, OR (US);
Roza Kotlyar, Camas, WA (US);
Ravi Pillarisetty, Portland, OR (US);
James S. Clarke, Portland, OR (US);
Mohammad Islam, Portlance, OR (US);
Stephanie Bojarski, Beaverton, OR (US);
Andrew J. Wagner, Beaverton, OR (US);
Eric Michael Henry, Forest Grove, OR (US);
Fahd Ayyalil Mohiyaddin, Beaverton, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Technologies for backside structures on a quantum processor die are disclosed. In an illustrative embodiment, qubits are defined in a silicon layer of a semiconductor stack in a quantum processor die. Traces such as plunger gates, barrier gates, etc., can be positioned above and below the stack to interact with the qubits in various ways, such as by influencing a potential defining the qubits, shifting the resonance frequency of the qubits, causing oscillations in parameters such as physical position, electric field, magnetic field, etc. Static and/or dynamic voltages and/or currents may be applied to the traces, causing static and/or dynamic electric and/or magnetic fields to be applied to the qubits. The quantum processor die with such structure may be created using various techniques such as flip chip processing.