The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Jun. 08, 2022
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Koichi Takatsuki, Nirasaki City, JP;
Tadahiro Ishizaka, Nirasaki City, JP;
Mikio Suzuki, Nirasaki City, JP;
Toshio Hasegawa, Nirasaki City, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H10P 50/28 (2026.01); C23C 16/02 (2006.01); C23C 16/06 (2006.01); C23C 16/455 (2006.01); H10P 14/43 (2026.01); H10W 20/00 (2026.01);
U.S. Cl.
CPC ...
H10P 50/285 (2026.01); C23C 16/0236 (2013.01); C23C 16/06 (2013.01); C23C 16/45525 (2013.01); H10P 14/43 (2026.01); H10W 20/056 (2026.01);
Abstract
There is provided a method of performing a surface processing on a substrate having a metal layer formed on a bottom portion of a recess formed in an insulating film, the method including: supplying a halogen-containing gas into a processing chamber in which the substrate is loaded; and removing a metal oxide from the bottom portion of the recess using the halogen-containing gas.