The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Jul. 06, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Suketu Parikh, San Jose, CA (US);

Andrew Yeoh, Portland, OR (US);

Tom S. Choi, Santa Clara, CA (US);

Joung Joo Lee, San Jose, CA (US);

Nitin K. Ingle, Santa Clara, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 50/28 (2026.01); H10P 14/60 (2026.01); H10W 20/00 (2026.01);
U.S. Cl.
CPC ...
H10P 50/283 (2026.01); H10P 14/6336 (2026.01); H10P 50/287 (2026.01); H10W 20/074 (2026.01); H10W 20/084 (2026.01); H10W 20/096 (2026.01);
Abstract

In some embodiments, an integrated tool for opening an etch stop layer and performing metallization comprises a first chamber with a remote plasma source, a direct plasma source, and a thermal source configured to open the etch stop layer on a substrate, a second chamber of the integrated tool with dry etch processing configured to pre-clean surfaces exposed by opening the etch stop layer, a third chamber of the integrated tool configured to deposit a barrier layer on the substrate, a fourth chamber of the integrated tool configured to deposit a liner layer on the substrate, and at least one fifth chamber of the integrated tool configured to deposit metallization material on the substrate. The integrated tool may also include a vacuum transfer chamber.


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