The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Apr. 07, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yu Jiang, Hsinchu, TW;

Ming-Hsun Lin, Hsinchu City, TW;

Lee-Chuan Tseng, New Taipei City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 1/00 (2025.01); H10D 1/66 (2025.01); H10D 1/68 (2025.01); H10P 50/24 (2026.01);
U.S. Cl.
CPC ...
H10D 1/042 (2025.01); H10D 1/665 (2025.01); H10D 1/716 (2025.01); H10P 50/242 (2026.01);
Abstract

Some implementations described herein include a deep trench capacitor structure and methods of formation. The deep trench capacitor structure may penetrate vertically into a silicon substrate. In some implementations, formation of the deep trench capacitor structure includes forming segments of a deep trench capacitor recess using a combination of in-situ oxidation/nitridation, ex-situ deposition, and reactive ion etching techniques. By forming the deep trench capacitor recess using the in-situ oxidation/nitridation operation, the ex-situ deposition, and the reactive ion etching techniques, a deep trench capacitor structure may be formed that meets target critical dimensions and has an aspect ratio of approximately 50:1.


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