The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Jun. 30, 2023
International Business Machines Corporation, Armonk, NY (US);
Nicholas Alexander Polomoff, Hopewell Junction, NY (US);
Terence Hook, Jericho Center, VT (US);
Matthew Stephen Angyal, Stormville, NY (US);
Brent A. Anderson, Jericho, VT (US);
Lawrence A. Clevenger, Saratoga Springs, NY (US);
Kisik Choi, Watervliet, NY (US);
Fee Li Lie, Albany, NY (US);
Ruilong Xie, Niskayuna, NY (US);
Lei Zhuang, Ridgefield, CT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A structure includes a semiconductor substrate; a plurality of first dielectric layers at a top side of the substrate; an active device layer at a top side of the first layers; a plurality of second dielectric layers at a top side of the device layer; first and second sense pads; and a metal body that electrically connects the pads. The metal body includes a first portion that is embedded in the first layers, made of a first plurality of discrete segments; a second portion that is embedded in the second layers, made of a second plurality of discrete segments, of which a first is electrically connected to the first pad and a second is electrically connected to the second pad; and a plurality of vias that interconnect the first and second portions. Breaking any of the vias reduces the electrical connectivity between the pads.