The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Apr. 06, 2022
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Annamalai Lakshmanan, Fremont, CA (US);
Yixiong Yang, Fremont, CA (US);
Srinivas Gandikota, Santa Clara, CA (US);
Joung Joo Lee, San Jose, CA (US);
Liqi Wu, San Jose, CA (US);
Jie Zhang, Sunnyvale, CA (US);
Tuerxun Ailihumaer, Santa Clara, CA (US);
Yogesh Sharma, Sunnyvale, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 14/60 (2026.01); H10W 20/00 (2026.01);
U.S. Cl.
CPC ...
H10P 14/6329 (2026.01); H10P 14/6314 (2026.01); H10W 20/057 (2026.01);
Abstract
Embodiments of the disclosure relate to methods for bottom-up metal gapfill without substantial deposition outside of the feature. Additional embodiments provide a method of forming a metal material on the top surface of the substrate and the bottom of the feature before depositing the metal gapfill.