The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Dec. 16, 2020
Applicant:

Globalfoundries U.s. Inc., Santa Clara, CA (US);

Inventors:

Mark D. Levy, Williston, VT (US);

Siva P. Adusumilli, South Burlington, VT (US);

Alvin J. Joseph, Williston, VT (US);

Assignee:

GlobalFoundries U.S. Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/763 (2006.01); H01L 23/367 (2006.01); H10D 86/00 (2025.01); H10P 90/00 (2026.01); H10W 10/00 (2026.01); H10W 10/10 (2026.01); H10W 10/40 (2026.01); H10W 40/22 (2026.01);
U.S. Cl.
CPC ...
H10P 90/1906 (2026.01); H10D 86/201 (2025.01); H10W 10/041 (2026.01); H10W 10/061 (2026.01); H10W 10/181 (2026.01); H10W 10/40 (2026.01); H10W 40/22 (2026.01);
Abstract

A structure includes an active device over an area of a substrate, and a heat spreading isolation structure adjacent the active device. The isolation structure includes a dielectric layer above a heat-conducting layer. The heat-conducting layer may include polycrystalline graphite. The heat-conducting layer provides a heat sink, which provides a high thermal conductivity path for heat with low electrical conductivity. The heat-conducting layer may extend into the substrate. The substrate may include an SOI substrate in which case the heat-conducting layer may extend through the buried insulator thereof.


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