The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Sep. 09, 2022
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Werner Schustereder, Villach, AT;

Roman Baburske, Otterfing, DE;

Hans-Joachim Schulze, Taufkirchen, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 32/10 (2026.01); H10D 62/10 (2025.01); H10D 62/13 (2025.01); H10D 62/17 (2025.01); H10P 30/20 (2026.01); H10P 32/14 (2026.01);
U.S. Cl.
CPC ...
H10P 32/171 (2026.01); H10D 62/124 (2025.01); H10D 62/133 (2025.01); H10D 62/393 (2025.01); H10P 30/204 (2026.01); H10P 30/21 (2026.01); H10P 32/1406 (2026.01);
Abstract

A method of forming a laterally varying dopant concentration profile of an electrically activated dopant in a power semiconductor device includes: providing a semiconductor body; implanting a dopant to form a doped region in the semiconductor body; providing, above the doped region, a mask layer having a first section and a second section, the first section having has a first thickness along a vertical direction and the second section having a second thickness along the vertical direction, the second thickness being different from the first thickness; and subjecting the doped region and both mask sections to a laser thermal annealing, LTA, processing step.


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