The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Dec. 30, 2022
Applicant:

Yangtze Memory Technologies Co., Ltd., Hubei, CN;

Inventors:

Peng Liu, Hubei, CN;

Baohua Zhang, Hubei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H10W 20/00 (2026.01); H10W 72/20 (2026.01); H10W 74/01 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 20/023 (2026.01); H10W 72/20 (2026.01); H10W 74/012 (2026.01); H10W 74/016 (2026.01); H10W 74/15 (2026.01); H10W 72/856 (2026.01); H10W 90/734 (2026.01);
Abstract

In one example, the disclosed semiconductor structure includes a package substrate, a first chip, a conductive pillar and a second chip, wherein the package substrate has a first surface; the first chip is located on the first surface of the package substrate and electrically connected to the package substrate; the conductive pillar is located on the first surface of the package substrate and electrically connected to the package substrate; the second chip is located on a side of the first chip and the conductive pillar away from the package substrate and electrically connected to the conductive pillar; and an orthographic projection of the conductive pillar on the package substrate is located within a range of an orthographic projection of the first chip or the second chip on the package substrate. The chip package structure is configured for connection with a circuit board in the electronic device. Other examples are disclosed.


Find Patent Forward Citations

Liu, Peng. (2026). Chip package structures, manufacturing methods thereof and electronic devices (U.S. Patent No. 12635579). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12635579

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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