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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12635553 B1

PDFFull Text
Date of Patent:
May. 19, 2026

Filed:

Jun. 02, 2022

Semiconductor device having a redistribution line

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Anhao Cheng, Hsinchu, TW;

Chun-Chang Liu, Hsinchu, TW;

Sheng-Wei Yeh, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Michelle Mandala

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/02 (2006.01); H01L 23/31 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); H01L 21/02118 (2013.01); H01L 21/0217 (2013.01); H01L 21/02282 (2013.01); H01L 23/3171 (2013.01); H01L 23/3192 (2013.01); H01L 23/5283 (2013.01); H01L 23/53295 (2013.01); H01L 23/562 (2013.01); H01L 23/525 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 2224/023 (2013.01); H01L 2224/02317 (2013.01); H01L 2224/02321 (2013.01); H01L 2224/0233 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/0236 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/0613 (2013.01); H01L 2224/06137 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13101 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1304 (2013.01);
Abstract

A semiconductor device includes a first passivation layer over a substrate. The semiconductor device further includes a post passivation interconnect (PPI) line over the first passivation layer, wherein a top-most portion of the PPI line has a first portion having a convex shape and a second portion having a concave shape. The semiconductor device further includes a second passivation layer configured to cause stress to the PPI line. The semiconductor device further includes a polymer material over the second passivation layer.

Find Patent Forward Citations

Cheng, Anhao. (2026). Semiconductor device having a redistribution line (U.S. Patent No. 12635553). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12635553

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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