The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jul. 25, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chieh-En Chen, Tainan City, TW;
Chen-Hsien Lin, Tainan City, TW;
Shyh-Fann Ting, Tainan City, TW;
Dun-Nian Yaung, Taipei City, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
The problem of connecting a TSV to a BEOL metal interconnect structure without damaging the BEOL metal interconnect structure is solved by landing the TSV on a metal coupling structure formed during FEOL processing. The metal coupling structure is produced in accordance with design rules that apply to FEOL processing. The metal coupling structure may include substructures that have the composition and shape of wires in a transistor level metal interconnect and substructures that have the composition and shape of metal gate strips. The metal coupling structure may include pluralities of the substructures arrayed across the TSV landing area. The substructures that make up the metal coupling structure are connected to the BEOL metal interconnect through vias.