The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Nov. 16, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ruilong Xie, Niskayuna, NY (US);

Stuart Sieg, Albany, NY (US);

Somnath Ghosh, Clifton Park, NY (US);

Kisik Choi, Watervliet, NY (US);

Kevin Shawn Petrarca, Newburgh, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 20/00 (2026.01); H10D 84/01 (2026.01); H10D 84/03 (2025.01); H10D 84/83 (2025.01); H10W 20/20 (2026.01); H10W 20/41 (2026.01);
U.S. Cl.
CPC ...
H10W 20/021 (2026.01); H10D 84/013 (2025.01); H10D 84/0149 (2025.01); H10D 84/0158 (2025.01); H10D 84/038 (2025.01); H10D 84/834 (2025.01); H10W 20/057 (2026.01); H10W 20/20 (2026.01); H10W 20/427 (2026.01);
Abstract

Embodiments disclosed herein describe a semiconductor structure. The semiconductor structure may include a device region with a first source/drain (S/D) and a second S/D. The semiconductor structure may also include a buried power rail (BPR) under the device region. A critical dimension of the BPR may be larger than a distance between the first S/D and the second S/D. The semiconductor structure may also include a via-contact-to-buried power rail (VBPR) between the BPR and the S/D.


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