The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Apr. 12, 2024
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Joongsuk Oh, Suwon-si, KR;

Jinuk Byun, Suwon-si, KR;

Hoyoung Kim, Suwon-si, KR;

Hyunkyu Moon, Suwon-si, KR;

Kiho Bae, Suwon-si, KR;

Boun Yoon, Suwon-si, KR;

Hojoon Lee, Suwon-si, KR;

Seunghoon Choi, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 52/00 (2026.01); G06N 3/04 (2023.01); H10P 72/00 (2026.01); H10P 74/20 (2026.01);
U.S. Cl.
CPC ...
H10P 52/00 (2026.01); G06N 3/04 (2013.01); H10P 72/06 (2026.01); H10P 74/203 (2026.01);
Abstract

An offset data correction method includes measuring a measurement target that has undergone a chemical mechanical polishing (CMP) process, generating an offset correction model based on the measurement of the measurement target, and using the offset correction model, correcting measured data obtained from the measurement of the measurement target, wherein the offset correction model is trained by using the measured data and layout data of the measurement target as inputs.


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