The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Mar. 28, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Du Zhang, Albany, NY (US);

Mingmei Wang, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/02 (2006.01); H01L 21/033 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31144 (2013.01); H01L 21/02211 (2013.01); H01L 21/0332 (2013.01); H01L 21/0337 (2013.01); H01L 21/31116 (2013.01);
Abstract

A method of processing a substrate that includes: flowing a fluorocarbon, a metal halide, and dihydrogen (H) into a plasma processing chamber, the plasma processing chamber configured to hold a substrate including a dielectric layer including silicon oxide as an etch target and a patterned hardmask including polycrystalline silicon (poly-Si) over the dielectric layer; while flowing the gases, generating a plasma in the plasma processing chamber; and forming a high aspect ratio feature by exposing the substrate to the plasma to etch a recess in the dielectric layer, where a metal-containing passivation layer is formed over the patterned hardmask during the exposing.


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