The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Feb. 10, 2022
Applicant:

United Microelectronics Corp., Hsin-Chu City, TW;

Inventors:

Chih-Kai Hsu, Tainan City, TW;

Ssu-I Fu, Kaohsiung City, TW;

Yu-Hsiang Lin, New Taipei City, TW;

Chien-Ting Lin, Tainan City, TW;

Assignee:

UNITED MICROELECTRONICS CORP., Hsin-Chu City, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 84/83 (2025.01); H10D 64/27 (2025.01); H10D 84/01 (2026.01); H10D 84/03 (2025.01); H10D 89/60 (2025.01);
U.S. Cl.
CPC ...
H10D 84/834 (2025.01); H10D 64/512 (2025.01); H10D 64/514 (2025.01); H10D 84/0151 (2025.01); H10D 84/0158 (2025.01); H10D 84/038 (2025.01); H10D 89/601 (2025.01); H10D 89/931 (2025.01); H10D 84/0144 (2025.01); H10D 84/0149 (2025.01);
Abstract

A semiconductor device includes a substrate, a first transistor, a second transistor and a third transistor. The substrate includes a high-voltage (HV) area, a medium-voltage (MV) area, and a low-voltage (LV) area. The first transistor is disposed in the HV area and includes a first gate dielectric layer and a first gate electrode. The second transistor is disposed in the LV area and includes a plurality of fin-shaped structures and a second gate electrode. The third transistor is disposed in the MV area and includes a third gate dielectric layer and a third gate electrode. The topmost surfaces of the first gate electrode, the second gate electrode and the third gate electrode are coplanar with each other.


Find Patent Forward Citations

Loading…