The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Apr. 22, 2024
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Lingming Yang, Meridian, ID (US);
Raghukiran Sreeramaneni, Frisco, TX (US);
Nevil N. Gajera, Meridian, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/02 (2006.01); H10B 80/00 (2023.01); H10W 90/00 (2026.01); H10W 90/20 (2026.01);
U.S. Cl.
CPC ...
G11C 5/02 (2013.01); H10B 80/00 (2023.02); H10W 90/00 (2026.01); H10W 90/297 (2026.01);
Abstract
An apparatus including a high bandwidth memory circuit and associated systems and methods are disclosed herein. The apparatus may include multiple HBM cubes connected to a processor, such as a GPU. The HBM cubes may be connected in series or in parallel. One or more of the HBM cubes can include a secondary communication circuit configured to facilitate the expanded connection between the multiple cubes.
Yang, Lingming. (2026). Apparatus including multiple high bandwidth memory cubes (U.S. Patent No. 12633319). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12633319
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile