The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Nov. 29, 2023
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Yaoying Zhong, Singapore, SG;
Haomin Xu, Singapore, SG;
Siew Kit Hoi, Singapore, SG;
Jay Min Soh, Singapore, SG;
Xiao Tan, Singapore, SG;
Li Ying Choo, Singapore, SG;
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/14 (2006.01); C23C 14/02 (2006.01); C23C 14/34 (2006.01); C23C 14/58 (2006.01);
U.S. Cl.
CPC ...
C23C 14/14 (2013.01); C23C 14/02 (2013.01); C23C 14/34 (2013.01); C23C 14/5806 (2013.01);
Abstract
Provided are methods of reducing the stress of a semiconductor wafer. The method includes exposing depositing an aluminum layer on a top surface of a substrate; and cooling the substrate to a temperature of less than or equal to 20° C., or less than or equal to 10° C., or less than or equal to 0° C., or less than or equal to −20° C. In some embodiments, the method is conducted within a processing tool, e.g., a cluster tool.