The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Sep. 21, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Darko Grujicic, Chandler, AZ (US);

Sashi S. Kandanur, Phoenix, AZ (US);

Helme A. Castro De La Torre, Gilbert, AZ (US);

Srinivas V. Pietambaram, Chandler, AZ (US);

Marcel Wall, Phoenix, AZ (US);

Suddhasattwa Nad, Chandler, AZ (US);

Rengarajan Shanmugam, Chandler, AZ (US);

Benjamin Duong, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/15 (2006.01); H10W 70/05 (2026.01); H10W 70/63 (2026.01); H10W 70/65 (2026.01); H10W 70/66 (2026.01); H10W 70/685 (2026.01); H10W 70/692 (2026.01);
U.S. Cl.
CPC ...
H10W 70/635 (2026.01); H10W 70/095 (2026.01); H10W 70/65 (2026.01); H10W 70/66 (2026.01); H10W 70/685 (2026.01); H10W 70/692 (2026.01);
Abstract

Embodiments described herein may be related to apparatuses, processes, and techniques related to glass layers within a package that include one or more high aspect ratio TGV that are filled with conductive material. The TGV extends from a first side of the glass layer to a second side of the glass layer opposite the first side and are filled with conductive material to provide a high-quality electrical connection between the first side of the glass layer and the second side of the glass layer, where a portion of the wall of the TGV includes titanium. Other embodiments may be described and/or claimed.


Find Patent Forward Citations

Loading…