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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12628582 B1

PDFFull Text
Date of Patent:
May. 12, 2026

Filed:

Jul. 07, 2022

Method of removing a by-product from a component of a semiconductor apparatus

Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Ren-Guan Duan, Hsinchu, TW;

Chen-Hsiang Lu, Hsin-Chu City, TW;

Chin-Feng Lin, Hsinchu County, TW;

Tung-Hsiung Liu, Tainan, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;

Attorneys:

WPAT LAW

Anthony King

Primary Examiner:

Natasha N Campbell

Int. Cl.
CPC ...
H01L 21/02 (2006.01); B08B 7/00 (2006.01); C23C 16/44 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0214 (2013.01); B08B 7/0071 (2013.01); C23C 16/4407 (2013.01); H01L 21/02326 (2013.01); H01L 21/6704 (2013.01); H01L 21/67109 (2013.01);
Abstract

A method of removing a nitride-containing by-product from a component of a semiconductor apparatus includes heating the component to a predetermined temperature for a predetermined duration, wherein the nitride-containing by-product is transformed into an oxide-containing or oxynitride-containing product by the heating; and removing the oxide-containing or oxynitride-containing product with an acid solution. Another method of removing a by-product from a component of a semiconductor apparatus includes heating the component to a predetermined temperature; cooling the component from the predetermined temperature to a room temperature; rinsing the component with an acid solution including and HNOafter the component is cooled; and washing the by-product and the acid solution off the component.

Find Patent Forward Citations

Duan, Ren-Guan. (2026). Method of removing a by-product from a component of a semiconductor apparatus (U.S. Patent No. 12628582). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12628582

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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