The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
May. 30, 2023
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Radhika P. Patil, Mountain View, CA (US);
Tatsuya E. Sato, San Jose, CA (US);
Haoyan Sha, San Jose, CA (US);
Abinash Tripathy, Santa Clara, CA (US);
Michael S. Jackson, Sunnyvale, CA (US);
Janardhan Devrajan, Santa Clara, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 64/01 (2025.01); H10D 30/43 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01);
U.S. Cl.
CPC ...
H10D 64/01318 (2026.01); H10D 30/43 (2025.01); H10D 30/6735 (2025.01); H10D 30/6739 (2025.01); H10D 62/121 (2025.01);
Abstract
Embodiments of the disclosure relate to methods of depositing seam-free gapfill. In some embodiments, the gapfill consists of titanium nitride. The gapfill methods comprise forming a first layer and a second layer. The firs layer is formed without treatment or densification, while the second layer is formed with periodic treatment. The resulting gapfill in advantageously seam-free.