The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Dec. 08, 2022
Qualcomm Incorporated, San Diego, CA (US);
Hong Bok We, San Diego, CA (US);
Joan Rey Villarba Buot, Escondido, CA (US);
Sang-Jae Lee, San Diego, CA (US);
Zhijie Wang, San Diego, CA (US);
QUALCOMM INCORPORATED, San Diego, CA (US);
Abstract
Disclosed are examples of die packages that incorporate metal frames with metal pockets. One or more dies may be placed within the metal pockets. Due to the structural integrity provided by the metal frame, warpage is reduced or eliminated. As a result, die packages with thin dies may be fabricated. Further, due to the electrical conductivity provided by the metal frame, the metal frame may be used as an electrical shield to protect the dies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile