The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Jun. 06, 2022
Intel Corporation, Santa Clara, CA (US);
Miriam Reshotko, Portland, OR (US);
Elijah Karpov, Portland, OR (US);
Mark Anders, Hillsboro, OR (US);
Gauri Auluck, Hillsboro, OR (US);
Shakuntala Sundararajan, Hillsboro, OR (US);
Michael Makowski, Sherwood, OR (US);
Caleb Barrett, Ridgefield, WA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Adjacent interconnect features are in staggered, vertically spaced positions, which accordingly reduces their capacitive coupling within a level of interconnect metallization. Adjacent interconnect features may comprise a plurality of first interconnect lines with spaces therebetween. A dielectric material is over the first interconnect lines and within the spaces between the first interconnect lines. Resultant topography in the dielectric material defines a plurality of trenches between the first interconnect lines. The adjacent interconnect features further comprise a plurality of second interconnect lines interdigitated with the first interconnect lines that occupy at least a portion of the trenches between individual ones of the first interconnect lines.