The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Mar. 22, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Xianghong Tong, Hillsboro, OR (US);

Martin Von Haartman, Portland, OR (US);

Zhiyong MA, Hillsboro, OR (US);

Jennifer J. Huening, Hillsboro, OR (US);

Hyuk Ju Ryu, Hillsboro, OR (US);

Christopher Morgan, Portland, OR (US);

Shuai Zhao, Beaverton, OR (US);

Ramune Nagisetty, Portland, OR (US);

Tuyen K. Tran, Portland, OR (US);

Wen-Hsien Chuang, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/307 (2006.01); G01R 1/02 (2006.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/26 (2020.01); G01R 31/305 (2006.01); G01R 31/311 (2006.01);
U.S. Cl.
CPC ...
G01R 31/307 (2013.01); G01R 1/07342 (2013.01);
Abstract

Wafer level electron beam prober systems, devices, and techniques, are described herein related to providing wafer level testing for fabricated device structures. Such wafer level testing contacts a first side of a die of a wafer with a probe to provide test signals to the die under test and performs e-beam imaging of the first side of the die while the test signals are provided to the die under test.


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