The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Oct. 06, 2020
Showa Denko Materials Co., Ltd., Tokyo, JP;
Naoko Mitsuishi, Tagawa, JP;
Shingo Nakano, Tagawa, JP;
Kouji Yamada, Tagawa, JP;
Hiroaki Fujino, Tagawa, JP;
Hirofumi Shiokawa, Tagawa, JP;
Yoji Hirai, Tagawa, JP;
RESONAC CORPORATION, Tokyo, JP;
Abstract
A foam-molded product including a foam layer, and a skin layer covering the foam layer, in which the maximum diameter of bubbles in the foam layer is 0.90 mm or less; and a method for manufacturing a foam-molded product and a method for suppressing an appearance defect of a foam-molded product, including an injection process and a foaming process, wherein the foam-molded product after molding includes a foam layer and a skin layer covering the foam layer, the skin layer having an average thickness of from 0.3 mm to 0.7 mm, and wherein expanding of the volume of the cavity includes performing a core-back process of the mold such that a thickness of the foam-molded product after molding is within ±0.2 mm of a predetermined target thickness.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile