The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
May. 11, 2023
Applicant:
Stats Chippac Pte. Ltd., Singapore, SG;
Inventors:
Yongmoo Shin, Incheon, KR;
Seongkuk Kim, Gyeonggi-do, KR;
Sinjae Kim, Incheon, KR;
Seokbeom Heo, Incheon, KR;
Assignee:
STATS ChipPAC Pte. Ltd., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01); H01L 23/00 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 21/60 (2021.08); H01L 23/552 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/73 (2013.01); H01L 24/94 (2013.01); H01L 2021/6024 (2013.01); H01L 2224/05493 (2013.01); H01L 2224/13026 (2013.01);
Abstract
A semiconductor device has a substrate. An electrical component is disposed over a first surface of the substrate. A solder paste is disposed over the first surface of the substrate. A conductive pillar is disposed on the solder paste. An encapsulant is deposited over the first surface of the substrate, the electrical component, and the conductive pillar. A solder bump is formed over the conductive pillar.