Metallization process for an integrated circuit

Abstract

The disclosure relates to a metallization process for an integrated circuit. One example metallization process includes a method for forming an integrated circuit that includes providing a semiconductor structure having two transistor structures, a gate structure, electrically conductive contacts, a first electrically conductive line, a first electrically conductive via, a second electrically conductive via. The method further includes providing a planar dielectric material in contact with the first electrically conductive line, forming an opening in the planar dielectric material, filling the opening with a planar electrically conductive material, forming an electrically conductive layer arranged within a second metallization level, the electrically conductive layer being in physical contact with the planar dielectric material and in physical and electrical contact with the electrically conductive material, providing a hard mask comprising a set of parallel lines, and etching the electrically conductive layer and the planar electrically conductive material by using the hard mask lines as a mask.